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Nr. Titel Autor Jahr
1 Failure Analysis for Electronic Packaging Materials: A Comparative Study of Pulsed Thermography and Lock-in Thermography Wu, Yanan* et al. 2025
2 Physics-Based Reliability Analysis of Power Modules at Substrate and Component Level Mathew, Anu et al. 2025
3 Thermal Characterization of Heat Pipe Embedded Heat Spreaders for High Performance Computer Cooling in Automotives Erol, Baris* et al. 2025
4 Closed-loop flow boiling cooler test stand for investigations on future power package designs Schacht, Ralph et al. 2024
5 CoolStar: A New Approach to Automotive HPC Cooling with Improved Thermo-Mechanical Design Erol, Baris* et al. 2024
6 Enhancing Defect Detection Using Lock In Thermography Mohamed, Doaa* et al. 2024
7 Full-Field IR-Thermography for Bond-Quality Inspection of Electroplated Aluminium Interconnects for Cryo-SiP Architectures Wunderle, Bernhard et al. 2024
8 Full-Field Through-Chip IR-Thermography-based Quality Testing & Failure Analysis on Electroplated Aluminium Interconnects for Cryogenic Applications in Ion-Trap Quantum Computers May, Daniel* et al. 2024
9 Multi-purpose Thermal Test Vehicle for Experimental Investigation on Pumped Two-Phase Cooling Schacht, Ralph* et al. 2024
10 Numerical Investigation of a Novel Lid Design for Automotive HPC Cooling Erol, Baris* et al. 2024
11 Synthetic data generation using finite element method to pre-train an image segmentation model for defect detection using infrared thermography Pareek, Kaushal Arun* et al. 2024
12 Thermal Characterisation and Technology of Intercalated Graphene-Based Nano-Laminates Wunderle, Bernhard et al. 2024
13 Experimental Investigation of Pumped Two-Phase Flow Boiling using Different Finned and Pin Finned Structures on Interchangeable Heater Modules Schacht, Ralph et al. 2023
14 Failure Analysis of Sintered Layers in Power Modules Using Laser Lock-in Thermography Panahandeh, S.* et al. 2023
15 Metal-based Direct Multi-jet Impingement Cooling Solution for Autonomous Driving High-Performance Vehicle Computer (HPVC) Moloudi, Reza* et al. 2023
16 Thermal Test Vehicle for HPC - System Level Approach for Investigation of the Thermal Heat Path Signature with the Property of Spatial Resolution Sternberg, Maik* et al. 2023
17 Validation of the thermal path with one phase liquid cooling for HPC in harsh environment Grün, Tobias et al. 2023
18 Accelerated Stress Testing and Failure Analysis of Thermal Greases Wunderle, Bernhard et al. 2022
19 Failure Analysis by Infrared and Thermoreflectance Imaging Applied on Active Devices May, Daniel* et al. 2022
20 Finite Element Supported Data Augmentation for a Deep Learning Driven Intelligent Failure Analysis System Based on Infrared Thermography Pareek, Kaushal Arun* et al. 2022
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