Eintrag in der Universitätsbibliographie der TU Chemnitz
Riegel, Daniel ; Gromala, Przemyslaw Jakub ; Rzepka, Sven
Analysis of the stress state in QFN package during four bending experiment utilizing piezoresistive stress sensor
| Universität: | Technische Universität Chemnitz | |
| Institut: | Zentrum für Mikrotechnologien (ZfM) | |
| Dokumentart: | Konferenzbeitrag, referiert | |
| ISBN/ISSN: | 978-1-6654-1373-2 ; 978-1-6654-1374-9 | |
| DOI: | doi:10.1109/EuroSimE52062.2021.9410886 | |
| URL/URN: | https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=9410886 | |
| Quelle: | 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2021 Apr 19-21, St. Julian (Malta). - IEEE, 2021. - 20674042 | |
| Freie Schlagwörter (Englisch): | Geometry , Temperature sensors , Temperature measurement , Bending , Predictive models , Numerical simulation , Silicon , bending , numerical analysis , piezoresistive devices , printed circuits , sensors , stress measurement |
