Ergebnis der Datenbankabfrage
Nr. | Titel | Autor | Jahr |
---|---|---|---|
1 | Analysis of the stress state in QFN package during four bending experiment utilizing piezoresistive stress sensor | Riegel, Daniel et al. | 2021 |
2 | Data-Driven Prediction of the Remaining useful Life of QFN Components Mounted on Printed Circuit Boards | Riegel, Daniel et al. | 2021 |
3 | Data-Driven Remaining Useful Life Prediction of QFN Packages on Board Level with On-Chip Stress Sensors | Riegel, Daniel et al. | 2021 |
4 | Machine learning based meta-models for sensorless thermal load prediction | Riegel, Daniel et al. | 2021 |
Anzahl der Ergebnisseiten: | 1 |
Anzahl der Dokumente: | 4 |