Ergebnis der Datenbankabfrage
Nr. | Titel | Autor | Jahr |
---|---|---|---|
1 | Review of percolating and neck-based underfills with thermal conductivities up to 3 W/m-K | Brunschwiler, Thomas et al. | 2016 |
2 | Review on Percolating and Neck-Based Underfills for Three-Dimensional Chip Stacks | Brunschwiler, Thomas et al. | 2016 |
3 | Self-assembly of micro- and nano-particles by centrifugal forces and capillary bridging for 3D thermal interconnects | Hofmann, Christian et al. | 2015 |
Anzahl der Ergebnisseiten: | 1 |
Anzahl der Dokumente: | 3 |