Ergebnis der Datenbankabfrage
Nr. | Titel | Autor | Jahr |
---|---|---|---|
1 | SIMEIT-Project: High Precision Inertial Sensor Integration on a Modular 3D-Interposer Platform | Steller, Wolfram et al. | 2014 |
2 | 3-D Thin Chip Integration Technology - from Technology Development to Application | Fritzsch, Thomas et al. | 2009 |
3 | Design Study of the Bump on Flexible Lead by FEA for Wafer Level Packaging | Eidner, Ines et al. | 2009 |
Anzahl der Ergebnisseiten: | 1 |
Anzahl der Dokumente: | 3 |