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Universitätsbibliographie | Universitätsbibliothek | TU Chemnitz

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Nr.	Titel	Autor	Jahr
1	A novel and practical method for in-situ monitoring of interface delamination by local thermal diffusivity measurement	Wunderle, Bernhard et al.	2015
2	In situ monitoring of interface delamination by the 3ω-Method	Schulz, Marcus et al.	2014
3	Accelerated reliability testing and modeling of Cu-plated through encapsulant vias (TEVs) for 3D-integration	Wunderle, Bernhard et al.	2013
4	Moisture transport and swelling stresses at moulding-compound substrate interfaces investigated by molecular modeling and finite element simulations	Hoelck, Ole et al.	2013
5	Reliability of Cu-plated through encapsulant vias (TEV) for 3D-integration	Heilmann, Jens et al.	2013
6	Transport of moisture at epoxy–SiO₂ interfaces investigated by molecular modeling	Hölck, Ole et al.	2013
7	Determination of interface fracture parameters by shear testing using different theoretical approaches	Dudek, Rainer et al.	2012
8	In-situ - characterization of moisture induced swelling behaviour of microelectronic relevant polymers	Walter, Hans et al.	2012
9	Transport of moisture at Epoxy-SiO2 interfaces investigated by Molecular Modeling	Hölck, Ole et al.	2012
10	Experimental and numerical reinvestigation for lifetime-estimation of plated through holes in printed circuit boards	Nowak, Thorsten et al.	2011
11	Influence of moisture on humidity sensitive material parametersof microelectonic relevant polymers	Walter, Hans et al.	2010
12	Interfacial Fracture Parameters of Silicon-to-Molding Compound	Schlottig, Gerd et al.	2010
13	Molecular Dynamics Approach to Structure-Property Correlation in Epoxy Resins for Thermo-Mechanical Lifetime Modeling.	Wunderle, Bernhard et al.	2010
14	Influence of moisture on the time and temperature dependent properties of polymer systems	Walter, Hans et al.	2009
15	Modeling cure shrinkage and viscoelasticity to enhance the numerical methods for predicting delamination in semiconductor packages	Shirangi, Hossein M. et al.	2009
16	Molecular Dynamics Approach to Structure-Property Correlation in Epoxy Resins for Thermo-Mechanical Lifetime Modelling	Wunderle, Bernhard et al.	2009
17	Molecular Dynamics Simulation and Mechanical Characterisation for the Establishment of Structure-Property Correlations for Epoxy Resins in Microelectronics Packaging Applications	Wunderle, Bernhard et al.	2009
18	Thermo-Mechanical Reliability during Technology Development of Power Chip-on-Board Assemblies with Encapsulation	Wunderle, Bernhard et al.	2009

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