Ergebnis der Datenbankabfrage
| Nr. | Titel | Autor | Jahr |
|---|---|---|---|
| 1 | Machine learning in chemical-mechanical planarization: A comprehensive review of trends, applications, and challenges | Winkler, Georg* et al. | 2025 |
| 2 | Real-Time End Point Detection via Automated Dynamic Mode Decomposition | Sayyed, Mudassir Ali* et al. | 2024 |
| 3 | Towards lightweight conductors: Improving the conductivity in graphitic films by transition metal additives | Niemann, Leonhard* et al. | 2024 |
| 4 | Towards knowledge-enhanced process models for semiconductor fabrication | Rothe, Tom et al. | 2023 |
| 5 | A Hybrid Chemical Mechanical Planarization (CMP) Model for Time-Dependent, Spatial Material Removal Rate Optimization | Rothe, Tom* et al. | 2022 |
| 6 | Automatic Analysis of CMP Dishing in Via Arrays from AFM Images | Langer, Jan* et al. | 2022 |
| 7 | Anisotropic transport properties of graphene-based conductor materials | Slawig, Diana et al. | 2021 |
| Anzahl der Ergebnisseiten: | 1 |
| Anzahl der Dokumente: | 7 |
