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Nr.	Titel	Autor	Jahr
1	Characterization of epoxy based highly filled die attach materials in microelectronics	Maus, Ingrid et al.	2017
2	Characterization of Adhesives for Microelectronic Industry in DMA and relaxation experiments for interfacial fracture toughness characterization – difficulties and solution	Maus, Ingrid et al.	2014
3	Determination of interface fracture parameters: Energy Release Rate and Mode Mixity using FEA	Maus, Ingrid et al.	2013
4	Advanced mixed-mode bending test: A rapid, inexpensive and accurate method for fracture-mechanical interface characterisation	Wunderle, Bernhard et al.	2012
5	Advanced Mixed-Mode Bending Test: A Rapid, Inexpensive and Accurate Method for Fracture-Mechanical Interface Characterisation	Wunderle, Bernhard et al.	2012
6	Establishing Mode Mix Dependency of Fracture Toughness in Microelectronic Components with Reduced Experimental Effort	Pape, Heinz et al.	2012
7	Fracture Toughness Characterization and Modeling of Interfaces in Microelectronic Packages - A Status Review	Pape, Heinz et al.	2012
8	Interfacial fracture toughness measurements in microelectronic packages with different test setups on samples from production	Maus, Ingrid et al.	2012
9	Fracture-Mechanical Interface Characterisation for Thermo-Mechanical Co-Design – An Efficient and Comprehensive Method for Critical Mixed-Mode Data Extraction	Wunderle, Bernhard et al.	2011
10	Interface fracture mechanics evaluation by correlation of experiment and simulation.	Keller, Jürgen et al.	2010
11	Interfacial Fracture Parameters of Silicon-to-Molding Compound	Schlottig, Gerd et al.	2010

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