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Nr. Titel Autor Jahr
1 Advanced Temperature Estimation in Low Rds,on p-GaN HEMT Devices for Performing Power Cycling Tests Franke, Jörg* et al. 2019
2 Estimating the chip temperature in an inverter by measuring the temperature sensitive Miller plateau during turn-off Hiller, Sebastian* et al. 2019
3 Experimental investigation of linear cumulative damage theory with power cycling test Zeng, Guang et al. 2019
4 Failure Mechanisms of Sintered Die Top Systems under Power Cycling Tests Hinrich, Andreas* et al. 2019
5 GaN-GIT power transistor switching behavior and application in a motor drive inverter Lutz, Michael* et al. 2019
6 Große Fortschritte bei Silizium- und Wide-Bandgap-Bauelementen Lutz, Josef 2019
7 Mit Leistungselektronik zum schnelleren Kohlestromausstieg Lutz, Josef 2019
8 Power cycling capability of silicon low-voltage MOSFETs under different operation conditions Schwabe, Christian et al. 2019
9 Reliability test results of PCB soldered GaN GIT devices Boldyrjew-Mast, Roman* et al. 2019
10 VGE,th(T) and VCE(T)-Method to Measure the Cooling of an IGBT After Short Circuit in an Inverter Hiller, Sebastian* et al. 2019
11 Bipolares Halbleiterbauelement und Verfahren zur Herstellung einer Halbleiterdiode Lutz, Josef et al. 2018
12 Difference in device temperature determination using pn-junction forward voltage and gate threshold voltage Zeng, Guang et al. 2018
13 Effects of Inorganic Encapsulation on Power Cycling Lifetime of Aluminum Bond Wires Jiang, Nan* et al. 2018
14 Experimental investigation of linear cumulative damage theory with power cycling test Zeng, Guang et al. 2018
15 First results of development of a lifetime model for transfer molded discrete power devices Zeng, Guang et al. 2018
16 Investigation of power cycling capability of a novel Cu wire bonded interconnection system Jiang, Nan* et al. 2018
17 Investigation of power cycling capability of advanced Cu wire bonding system (DTS®) Jiang, Nan* et al. 2018
18 Investigation of thermal conditions in power modules for traction application depending on the delamination of the system solder Schwabe, Christian et al. 2018
19 Investigation of ton Dependency of Al-clad Cu Bond Wires under Power Cycling Tests Jiang, Nan* et al. 2018
20 Investigation on the interaction between surge current pulse and power cycling test Li, Zheming et al. 2018
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Anzahl der Dokumente: 253

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