Ergebnis der Datenbankabfrage
| Nr. | Titel | Autor | Jahr |
|---|---|---|---|
| 1 | Fabrication of local areas of high aspect ratio silicon structures using metal-assisted chemical etching | Franz, Mathias et al. | 2023 |
| 2 | Fabrication of local areas of high aspect ratio silicon structures using metal-assisted chemical etching - MACE | Franz, Mathias et al. | 2023 |
| 3 | Wafer-level integration of self-aligned high aspect ratio silicon 3D structures using the MACE method with Au, Pd, Pt, Cu, and Ir | Franz, Mathias* et al. | 2020 |
| 4 | Temporary wafer bonding - key technology for MEMS devices | Wünsch, Dirk* et al. | 2017 |
| Anzahl der Ergebnisseiten: | 1 |
| Anzahl der Dokumente: | 4 |
