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Nr. Titel Autor Jahr
1 Power Cycling Test Bench Topology with Alternating Load Current and Online Temperature Measurement for Thyristor Devices Herold, Christian* et al. 2020
2 Experimental investigation of linear cumulative damage theory with power cycling test Zeng, Guang et al. 2019
3 Experimental investigation of linear cumulative damage theory with power cycling test Zeng, Guang et al. 2018
4 Determination of State-of-Health and Remaining Lifetime of Power Modules Franke, Jörg* et al. 2017
5 Power cycling methods for SiC MOSFETs Herold, Christian et al. 2017
6 Power cycling test with power generated by an adjustable part of switching losses Seidel, Peter* et al. 2017
7 Acoustic Emission for State-of-Health Determination in Power Modules Müller, Sebastian* et al. 2016
8 High-Current Power Cycling Test-Bench for Short Load Pulse Duration and First Results Zeng, Guang et al. 2016
9 Internal processes in power semiconductors at virtual junction temperature measurement Chen, Weinan* et al. 2016
10 Nichtinvasive Überwachung von Leistungselektronik mittels Schallemissionsanalyse Müller-Blumhagen, Sebastian* et al. 2016
11 Requirements in power cycling for precise lifetime estimation Herold, Christian* et al. 2016
12 Topologies for inverter like operation of power cycling tests Herold, Christian* et al. 2016
13 Analyse chipnaher Verbindungen mittels thermisch sensibler elektrischer Parameter Herold, Christian et al. 2015
14 Methods for virtual junction temperature measurement respecting internal semiconductor processes Herold, Christian et al. 2015
15 Measurement of Tvj in a B6 IGBT inverter for electric vehicles using the Vce(T)-method Hiller, Sebastian et al. 2014
16 On-line temperature measurement of SiC-BJTs using Vbe thermal sensitive electrical parameters Frankeser, Sophia et al. 2014
17 Power cycling capability of Modules with SiC-Diodes Herold, Christian et al. 2014
18 Improving the Accuracy of Junction Temperature Measurement with the Square-Root-t Method Herold, Christian et al. 2013
19 Reliability of Discrete Power Semiconductor Packages and Systems – D2Pak and CanPAK in Comparison Hofmann, Kay et al. 2013
20 Verfahren und Einrichtung zur Ermittlung der Temperaturkalibrierkennlinie eines Halbleiterbauelements der Leistungselektronik Bohlländer, Marco et al. 2013
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Anzahl der Dokumente: 25

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