Ergebnis der Datenbankabfrage
| Nr. | Titel | Autor | Jahr |
|---|---|---|---|
| 1 | Full-Field IR-Thermography for Bond-Quality Inspection of Electroplated Aluminium Interconnects for Cryo-SiP Architectures | Wunderle, Bernhard et al. | 2024 |
| 2 | Full-Field Through-Chip IR-Thermography-based Quality Testing & Failure Analysis on Electroplated Aluminium Interconnects for Cryogenic Applications in Ion-Trap Quantum Computers | May, Daniel* et al. | 2024 |
| 3 | Optimal design configuration for aluminum pillar fabrication towards fine pitch ultrasonic bonding applications | Cirulis, Imants et al. | 2022 |
| Anzahl der Ergebnisseiten: | 1 |
| Anzahl der Dokumente: | 3 |
