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Nr.	Titel	Autor	Jahr
1	Accelerated Pump Out Testing for Thermal Greases	Wunderle, Bernhard* et al.	2019
2	Latest advancements towards delamination detection in a FCOB assembly using Thermal Pixel (Thixel) array	Kumar, Akhil* et al.	2019
3	Delamination Detection in an Electronic Package by Means of a Newly Developed Delamination Chip Based on Thermal Pixel (Thixel) Array	Kumar, Akhil et al.	2018
4	Modelling and characterisation of a grease pump-out test stand and its use for accelerated stress testing of thermal greases	Wunderle, Bernhard* et al.	2017
5	Effektiv auf kleinstem Raum	Ayhan, Serdal et al.	2013
6	Planar positioning stage for micro machining	Bauer, Jörg et al.	2013
7	Transport of moisture at epoxy–SiO₂ interfaces investigated by molecular modeling	Hölck, Ole et al.	2013
8	Comparative Characterization of Chip to Epoxy Interfaces by Molecular Modeling and Contact Angle Determination	Hölck, Ole et al.	2012
9	In-situ - characterization of moisture induced swelling behaviour of microelectronic relevant polymers	Walter, Hans et al.	2012
10	Transport of moisture at Epoxy-SiO2 interfaces investigated by Molecular Modeling	Hölck, Ole et al.	2012
11	Basic thermo-mechanical property estimation of a 3D-crosslinked epoxy/SiO₂ interface using molecular modelling	Hölck, Ole et al.	2011
12	Comparative Characterization of Chip to Epoxy Interfaces by Molecular Modeling and Contact Angle Determination	Hölck, Ole et al.	2011
13	Experimental Contact Angle Determination and Characterisation of Interfacial Energies by Molecular Modelling of Chip to Epoxy Interfaces	Hölck, Ole et al.	2011
14	Molecular Dynamics Approach to Structure-Property Correlation in Epoxy Resins for Thermo-Mechanical Lifetime Modeling.	Wunderle, Bernhard et al.	2010
15	Molecular Modeling of a 3D-Crosslinked Epoxy Resin and its Interface to Native SiO2 - Property Prediction in Microelectronic Packaging	Hölck, Ole et al.	2010
16	Molecular Modelling of Microelectronic Packaging Materials - Basic Thermo-Mechanical Property Estimation of a 3D-crosslinked Epoxy / SiO2 Interface.	Hölck, Ole et al.	2010
17	Molecular Dynamics Approach to Structure-Property Correlation in Epoxy Resins for Thermo-Mechanical Lifetime Modelling	Wunderle, Bernhard et al.	2009
18	Molecular Dynamics Simulation and Mechanical Characterisation for the Establishment of Structure-Property Correlations for Epoxy Resins in Microelectronics Packaging Applications	Wunderle, Bernhard et al.	2009

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Anzahl der Ergebnisseiten:	1
Anzahl der Dokumente:	18