Eintrag in der Universitätsbibliographie der TU Chemnitz
Steller, Antje ; Schwengber, Moritz ; Yildiz, Ömer Faruk ; Franke, Jörg
Thermal Characterization of Electrically Conductive Adhesives and Pressureless Sinter Pastes Comparison of Data Sheet and Real Application
| Universität: | Technische Universität Chemnitz | |
| Institut: | Professur Leistungselektronik | |
| Dokumentart: | Konferenzbeitrag, referiert | |
| ISBN/ISSN: | Electronic ISBN: 978-1-7395005-1-1 ; Print on Demand(PoD) ISBN: 979-8-3315-6575-6 | |
| DOI: | doi:10.23919/empc63132.2025.11222465 | |
| Quelle: | 25th European Microelectronics and Packaging Conference & Exhibition (EMPC), Grenoble, France, 2025, pp. 1-6. - IEEE, 2025 | |
| Freie Schlagwörter (Englisch): | Thermal resistance , Conductivity , Conductivity measurement , Thermal conductivity , Electronic packaging thermal management , Electrical resistance measurement , Transient analysis , Thermal stability , Conductive adhesives , Microassembly , die attach , thermal conductivity , thermal transient measurement |
