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Nr.	Titel	Autor	Jahr
1	Accelerated reliability testing and modeling of Cu-plated through encapsulant vias (TEVs) for 3D-integration	Wunderle, Bernhard et al.	2013
2	Moisture transport and swelling stresses at moulding-compound substrate interfaces investigated by molecular modeling and finite element simulations	Hoelck, Ole et al.	2013
3	Reliability of Cu-plated through encapsulant vias (TEV) for 3D-integration	Heilmann, Jens et al.	2013
4	Transport of moisture at epoxy–SiO₂ interfaces investigated by molecular modeling	Hölck, Ole et al.	2013
5	Comparative Characterization of Chip to Epoxy Interfaces by Molecular Modeling and Contact Angle Determination	Hölck, Ole et al.	2012
6	In-situ - characterization of moisture induced swelling behaviour of microelectronic relevant polymers	Walter, Hans et al.	2012
7	Transport of moisture at Epoxy-SiO2 interfaces investigated by Molecular Modeling	Hölck, Ole et al.	2012
8	Comparative Characterization of Chip to Epoxy Interfaces by Molecular Modeling and Contact Angle Determination	Hölck, Ole et al.	2011
9	Experimental and numerical reinvestigation for lifetime-estimation of plated through holes in printed circuit boards	Nowak, Thorsten et al.	2011
10	Experimental Contact Angle Determination and Characterisation of Interfacial Energies by Molecular Modelling of Chip to Epoxy Interfaces	Hölck, Ole et al.	2011
11	DoE Simulations with the MicroDAC-Stress-Chip for Material and Package Investigations.	Schindler-Saefkow, Florian et al.	2010
12	Modeling cure shrinkage and viscoelasticity to enhance the numerical methods for predicting delamination in semiconductor packages	Shirangi, Hossein M. et al.	2009
13	Progress in Thermal Characterisation Methods and Thermal Interface Technology within the "Nanopack" Project	Wunderle, Bernhard et al.	2009
14	Thermo-Mechanical Reliability during Technology Development of Power Chip-on-Board Assemblies with Encapsulation	Wunderle, Bernhard et al.	2009

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Anzahl der Dokumente:	14