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Nr. Titel Autor Jahr
1 Closed-loop flow boiling cooler test stand for investigations on future power package designs Schacht, Ralph et al. 2024
2 Full-Field IR-Thermography for Bond-Quality Inspection of Electroplated Aluminium Interconnects for Cryo-SiP Architectures Wunderle, Bernhard et al. 2024
3 Multi-purpose Thermal Test Vehicle for Experimental Investigation on Pumped Two-Phase Cooling Schacht, Ralph* et al. 2024
4 Experimental Investigation of Pumped Two-Phase Flow Boiling using Different Finned and Pin Finned Structures on Interchangeable Heater Modules Schacht, Ralph et al. 2023
5 Realization, multi-field coupled simulation and characterization of a thermo-mechanically robust LiDAR front end on a copper coated glass substrate Kettelgerdes, Marcel* et al. 2023
6 Thermo-fluidic characterization of automotive LiDAR module under realistic enforced air-cooling conditions in a closed wind tunnel Tavakolibasti, Majid et al. 2021
7 Accelerated Pump Out Testing for Thermal Greases Wunderle, Bernhard* et al. 2019
8 Modelling and characterisation of a grease pump-out test stand and its use for accelerated stress testing of thermal greases Wunderle, Bernhard* et al. 2017
9 Efficiency optimization for a frictionless air flow blade fan – design study Schacht, Ralph K. B. et al. 2014
10 Feasibility and design study of a frictionless air mover for thermal management of electronics Schacht, Ralph et al. 2014
11 Development and fabrication of a thin film thermo test chip and its integration into a test system for thermal interface characterization Abo Ras, Mohamad et al. 2013
12 Transient thermal response as failure analytical tool - A comparison of different techniques May, Daniel et al. 2013
13 Transient thermal techniques as failure analytical tool May, Daniel et al. 2013
14 Frictionless Air Flow Blade Fan for Thermal Management of Electronics Schacht, Ralph et al. 2012
15 Modelling and Characterisation of Smart Power Devices Wunderle, Bernhard et al. 2012
16 Transient thermal analysis as failure analytical tool in electronic packaging May, Daniel et al. 2012
17 Combined and accelerated in-situ measurement method for reliability and aging analyses of thermal interface materials Abo Ras, Mohamad et al. 2011
18 Experimental and numerical reinvestigation for lifetime-estimation of plated through holes in printed circuit boards Nowak, Thorsten et al. 2011
19 Advances in Thermal Interface Technology: Mono-Metal Interconnect Formation, Processing and Characterisation Wunderle, Bernhard et al. 2010
20 Design and Development of a Miniaturized Black Body Device for in-situ IR-Camera Calibration Schacht, Ralph et al. 2010
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