Ergebnis der Datenbankabfrage

Nr.	Titel	Autor	Jahr
1	Extended tensor description to design non-uniform heat-removal in interlayer cooled chip stacks	Brunschwiler, Thomas et al.	2012
2	Angle-of-attack investigation of pin-fin arrays in nonuniform heat-removal cavities for interlayer cooled chip stacks	Brunschwiler, Thomas et al.	2011
3	Advances in Thermal Interface Technology: Mono-Metal Interconnect Formation, Processing and Characterisation	Wunderle, Bernhard et al.	2010
4	Heat-Removal Performance Scaling of Interlayer Cooled Chip Stacks	Brunschwiler, T. et al.	2010
5	Molecular Dynamics Approach to Structure-Property Correlation in Epoxy Resins for Thermo-Mechanical Lifetime Modeling.	Wunderle, Bernhard et al.	2010
6	Molecular Modeling of a 3D-Crosslinked Epoxy Resin and its Interface to Native SiO2 - Property Prediction in Microelectronic Packaging	Hölck, Ole et al.	2010
7	Reliability Study of the Stud Bump Bonding Flip Chip Technology on Molded Interconnect Devices	Dressler, M. et al.	2010
8	3-D Thin Chip Integration Technology - from Technology Development to Application	Fritzsch, Thomas et al.	2009
9	Design Study of the Bump on Flexible Lead by FEA for Wafer Level Packaging	Eidner, Ines et al.	2009
10	Molecular Dynamics Approach to Structure-Property Correlation in Epoxy Resins for Thermo-Mechanical Lifetime Modelling	Wunderle, Bernhard et al.	2009
11	Thermo-Mechanical Reliability during Technology Development of Power Chip-on-Board Assemblies with Encapsulation	Wunderle, Bernhard et al.	2009