Ergebnis der Datenbankabfrage
| Nr. | Titel | Autor | Jahr |
|---|---|---|---|
| 1 | Fatigue Delamination Study of Parylene as Electronic Packaging Material | Rincon, Carlos et al. | 2025 |
| 2 | Parylene C based memristors for the realization of ultra-thin and flexible smart systems | Selbmann, Franz et al. | 2025 |
| 3 | Parylene as a Novel Packaging Material for Adhesive Bonding, Flexible Electronics and Wafer Level Packaging | Selbmann, Franz et al. | 2024 |
| 4 | Dendrimer-stabilized bimetallic Pd/Au nanoparticles: Preparation, characterization and application to vinyl acetate synthesis | Kuhn, Martin et al. | 2014 |
| Anzahl der Ergebnisseiten: | 1 |
| Anzahl der Dokumente: | 4 |
