Eintrag in der Universitätsbibliographie der TU Chemnitz
Schwabe, Christian
Basler, Thomas (Prof. Dr.-Ing.) ; Kaminski, Nando (Prof. Dr.-Ing.) (Gutachter)
Investigation of thermomechanical fatigue processes in power electronic packages with experiment and simulation
Kurzfassung in englisch
This work deals with the power cycling reliably of power modules and discrete devices. A small part was tested with standard test equipment, but the majority of devices were tested with an advanced test approach with additional switching losses. A large variety of packages under different conditions were tested: Discrete low-voltage silicon MOSFETs (<100 V), discrete SiC MOSFETs, baseplate-free SiC modules, medium power silicon modules and high power silicon modules. The core of the work is the investigation of low temperature swings in the transition between elastic and plastic deformation. During high operation temperatures, no significant increase in lifetime was observed, but at reduced junction temperatures, the impact was significant. All experimental results were transferred into a 3D simulation environment, for further investigation of the temperature and current distribution as well as the mechanical fatigue parameters, to allow a better understanding of the physical processes.
| Universität: | Technische Universität Chemnitz | |
| Institut: | Professur Leistungselektronik | |
| Fakultät: | Fakultät für Elektrotechnik und Informationstechnik | |
| Dokumentart: | Dissertation | |
| Betreuer: | Basler, Thomas (Prof.) | |
| URL/URN: | https://nbn-resolving.org/urn:nbn:de:bsz:ch1-qucosa2-859467 | |
| Quelle: | 2023. - 229 S. | |
| SWD-Schlagwörter: | Leistungselektronik , Zuverlässigkeit , Lebensdauer | |
| Freie Schlagwörter (Englisch): | Reliability , Semiconductor , Power cycling test , Basquin zone , 3D simulation | |
| DDC-Sachgruppe: | 621.3 | |
| Sprache: | englisch | |
| Tag der mündlichen Prüfung | 02.05.2023 | |
| OA-Lizenz | CC BY 4.0 |
