Ergebnis der Datenbankabfrage
| Nr. | Titel | Autor | Jahr |
|---|---|---|---|
| 1 | Multi material ultrasonic joining using microstructured joining partners | Schulze, René et al. | 2016 |
| 2 | Joining of copper using silver nanoparticles under mild conditions | Schulze, Rene et al. | 2015 |
| 3 | JOINING AND CONTACTING OF SENSOR MODULES ON PRINTED ELECTRONICS USING ULTRASONIC VIBRATION | Schubert, Andreas et al. | 2014 |
| 4 | Vibration Analysis of an Ultrasonic-assisted Joining System | Schubert, Andreas et al. | 2014 |
| Anzahl der Ergebnisseiten: | 1 |
| Anzahl der Dokumente: | 4 |
