Ergebnis der Datenbankabfrage
Nr. | Titel | Autor | Jahr |
---|---|---|---|
1 | Characterization of epoxy based highly filled die attach materials in microelectronics | Maus, Ingrid et al. | 2017 |
2 | Characterization of Adhesives for Microelectronic Industry in DMA and relaxation experiments for interfacial fracture toughness characterization – difficulties and solution | Maus, Ingrid et al. | 2014 |
Anzahl der Ergebnisseiten: | 1 |
Anzahl der Dokumente: | 2 |