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Nr.	Titel	Autor	Jahr
1	Possible failure modes in Press-Pack IGBTs	Tinschert, Lukas* et al.	2015
2	Power cycling capability of Modules with SiC-Diodes	Herold, Christian et al.	2014
3	Thermal and thermal-mechanical simulation for the prediction of fatigue processes in packages for power semiconductor devices	Poller, Tilo	2014
4	Analysis of the plastic deformation in aluminium metallizations of Al2O3 - based DAB substrates	Poller, Tilo et al.	2013
5	Approach of a physically based lifetime model for solder layers in power modules	Steinhorst, Peter et al.	2013
6	Comparison of the thermal cycling capability between power moduleswith DAB and DCB substrates with Al2O3 ceramic	Poller, Tilo et al.	2013
7	Determination of the thermal and electrical contact resistance of press pack housings	Poller, Tilo et al.	2013
8	Evaluation of the submodel technique for FEM simulations of power electronic housings under power cycling conditions	Tinschert, Lukas et al.	2013
9	Influence of the clamping pressure on the electrical, thermal and mechanical behaviour of press-pack IGBTs	Poller, Tilo et al.	2013
10	Influence of thermal cross-couplings on power cycling lifetime of IGBT power modules	Poller, Tilo et al.	2012
11	Mechanical analysis of press-pack IGBTs	Poller, Tilo* et al.	2012
12	Comparison of the Mechanical Load in Solder Joints Using SiC and Si Chips	Poller, Tilo et al.	2010
13	Thermal-mechanical analysis of solder layers in power modules under superimposed cycling conditions	Poller, Tilo et al.	2010
14	Thermal-Mechanical Behaviour of Solder Layers in Power Modules	Poller, Tilo et al.	2009

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Anzahl der Ergebnisseiten:	1
Anzahl der Dokumente:	14