Ergebnis der Datenbankabfrage

Nr.	Titel	Autor	Jahr
1	Temporary wafer bonding - key technology for MEMS devices	Wünsch, Dominik* et al.	2018
2	Poster session 25: Biosignal processing and monitoring III	Schröder, T. et al.	2017
3	A novel method for the fabrication of deep-submicron structure	Jia, C. et al.	2009
4	Characterization of eutectic wafer bonding using Gold and Silicon	Lin, Y. C. et al.	2009
5	Development and Evaluation of AuSi Eutectic Wafer Bonding	Lin, Y. C. et al.	2009
6	Hermetic Thin Film Encapsulation of Mechanical Transducers for Smart Label Applications	Reuter, D. et al.	2009
7	New Bonding Technologies for MEMS Applications	Wiemer, M. et al.	2009
8	Process Development for Smart Systems Integration in MEMS	Ecke, R. et al.	2009
9	Smart Systems Integration by Using Micro and Nano Technologies	Gessner, T. et al.	2009
10	Thermocompresion bonding with gold interfaces	Froemel, J. et al.	2009
11	Two Lithography-Based Technologies for the Fabrication of Submicron to Deep-Submicron Structures	Jia, C. et al.	2009
12	Developments Trends in the Field of Wafer Bonding Technologies	Wiemer, M. et al.	2008
13	Fabrication of a Low-Frequency Ultrasonic Transducer.	Jia, C. et al.	2008
14	Herstellung von Nanostrukturen und ihre Anwendung für Fügeverbindungen.	Jia, C. et al.	2008
15	Infrared Study of Si Surfaces and Buried Interfaces	Milekhin, A. et al.	1999
16	Infrared Spectroscopic Characterization of the Buried Interface and Surfaces of Bonded Silicon Wafers	Friedrich, M.* et al.	1998