Ergebnis der Datenbankabfrage
| Nr. | Titel | Autor | Jahr |
|---|---|---|---|
| 1 | Thermal-Resistance-Based Reliability of TIM1 Materials in a Lidded Thermal Test Vehicle Under Active Thermal Load-Cycling | Sternberg, Maik et al. | 2025 |
| 2 | Inline failure analysis of electronic components by infrared thermography without high-emissivity spray coatings | Wargulski, Dan R. et al. | 2020 |
| 3 | An In-line Failure Analysis System Based on IR Thermography Ready for Production Line Integration | Wargulski, Dan R.* et al. | 2019 |
| 4 | Comparative Die-Attach Failure Analysis by Thermoreflectance, Infrared Thermography and Scanning Acoustic Microscopy | Wargulski, Dan R.* et al. | 2018 |
| Anzahl der Ergebnisseiten: | 1 |
| Anzahl der Dokumente: | 4 |
