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Nr. Titel Autor Jahr
1 Impact of Dielectric and Copper Via Design on Wafer-to-Wafer Hybrid Bonding Dubey, Vikas* et al. 2023
2 Optimal design configuration for aluminum pillar fabrication towards fine pitch ultrasonic bonding applications Cirulis, Imants et al. 2022
3 Reaktives Bonden Vogel, Klaus et al. 2021
4 An Improved Design for 2D Arrays of Capacitive Micromachined Ultrasound Transducers: Modeling, Fabrication, and Characterization Baum, Mario* et al. 2018
5 Reactive bonding with oxide based reactive multilayers Vogel, Klaus et al. 2018
6 3D Wafer Level Packaging By Using Cu-Through Silicon Vias For Thin Mems Accelerometer Packages Hofmann, Lutz et al. 2017
7 Low Temperature Thermo Compression Bonding with Printed Intermediate Bonding Layers Wiemer, Maik et al. 2016
8 Evaluation of sputtered Pd76Cu6Si18 metallic glass for MEMS application Vogel, Klaus et al. 2015
9 Improvement of Copper Bonding by Analyzing the Mechanical Properties of the Bond Interface Vogel, Klaus et al. 2014
10 Overview of Wafer Bonding and Characterization of the Bonded Interface Vogel, Klaus et al. 2014
11 Wafer Bonding Technologies for 3D Integration Baum, Mario et al. 2014
12 Festigkeitsanalyse an thermokompressionsgebondeten Sensorstrukturen in Abhängigkeit von der Oberflächenvorbehandlung Vogel, Klaus et al. 2012
13 Influence of test speed on the bonding strength of glass frit bonded wafers Vogel, Klaus et al. 2012
14 Mechanical characterization of glass frit bonded wafers Vogel, Klaus et al. 2012
15 CHARACTERISATION OF SURFACE ACOUSTIC WAVE SENSORS FOR STRAIN MEASUREMENT Vogel, Klaus et al. 2011
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