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Universitätsbibliothek

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Nr.	Titel	Autor	Jahr
1	Impact of Dielectric and Copper Via Design on Wafer-to-Wafer Hybrid Bonding	Dubey, Vikas* et al.	2023
2	Optimal design configuration for aluminum pillar fabrication towards fine pitch ultrasonic bonding applications	Cirulis, Imants et al.	2022
3	Reaktives Bonden	Vogel, Klaus et al.	2021
4	An Improved Design for 2D Arrays of Capacitive Micromachined Ultrasound Transducers: Modeling, Fabrication, and Characterization	Baum, Mario* et al.	2018
5	Reactive bonding with oxide based reactive multilayers	Vogel, Klaus et al.	2018
6	3D Wafer Level Packaging By Using Cu-Through Silicon Vias For Thin Mems Accelerometer Packages	Hofmann, Lutz et al.	2017
7	Low Temperature Thermo Compression Bonding with Printed Intermediate Bonding Layers	Wiemer, Maik et al.	2016
8	Evaluation of sputtered Pd76Cu6Si18 metallic glass for MEMS application	Vogel, Klaus et al.	2015
9	Improvement of Copper Bonding by Analyzing the Mechanical Properties of the Bond Interface	Vogel, Klaus et al.	2014
10	Overview of Wafer Bonding and Characterization of the Bonded Interface	Vogel, Klaus et al.	2014
11	Wafer Bonding Technologies for 3D Integration	Baum, Mario et al.	2014
12	Festigkeitsanalyse an thermokompressionsgebondeten Sensorstrukturen in Abhängigkeit von der Oberflächenvorbehandlung	Vogel, Klaus et al.	2012
13	Influence of test speed on the bonding strength of glass frit bonded wafers	Vogel, Klaus et al.	2012
14	Mechanical characterization of glass frit bonded wafers	Vogel, Klaus et al.	2012
15	CHARACTERISATION OF SURFACE ACOUSTIC WAVE SENSORS FOR STRAIN MEASUREMENT	Vogel, Klaus et al.	2011

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Anzahl der Dokumente:	15