Ergebnis der Datenbankabfrage
| Nr. | Titel | Autor | Jahr |
|---|---|---|---|
| 1 | Thermal-Resistance-Based Reliability of TIM1 Materials in a Lidded Thermal Test Vehicle Under Active Thermal Load-Cycling | Sternberg, Maik et al. | 2025 |
| 2 | Thermal Test Vehicle for HPC - System Level Approach for Investigation of the Thermal Heat Path Signature with the Property of Spatial Resolution | Sternberg, Maik* et al. | 2023 |
| 3 | Thermal Heat Path Signature of a Standard D2PAK Power Package by Transient Thermal Characterization and Modelling | Sternberg, Maik* et al. | 2022 |
| 4 | Effect of Different Deconvolution Methods on Structure Function Calculation | Pareek, Kaushal Arun* et al. | 2020 |
| Anzahl der Ergebnisseiten: | 1 |
| Anzahl der Dokumente: | 4 |
