Ergebnis der Datenbankabfrage
| Nr. | Titel | Autor | Jahr |
|---|---|---|---|
| 1 | Fatigue Crack Growth Analysis of Interface Between Lead Frame and Molding Compound | Bektas, Erkan et al. | 2018 |
| 2 | Robust design optimization: On methodology and short review | Bektas, Erkan* et al. | 2017 |
| 3 | An in-situ numerical-experimental approach for fatigue delamination characterization in Microelectronic Packages | Poshtan, Emad A.* et al. | 2016 |
| 4 | Accelerated Determination of Interfacial Fracture Toughness in Microelectronic Packages under Cyclic Loading | Poshtan, Emad et al. | 2015 |
| 5 | An accelerated method for characterization of bi-material interfaces in microelectronic packages under cyclic loading conditions | Poshtan, Emad A. et al. | 2014 |
| Anzahl der Ergebnisseiten: | 1 |
| Anzahl der Dokumente: | 5 |
