Ergebnis der Datenbankabfrage
| Nr. | Titel | Autor | Jahr |
|---|---|---|---|
| 1 | Full-Field Through-Chip IR-Thermography-based Quality Testing & Failure Analysis on Electroplated Aluminium Interconnects for Cryogenic Applications in Ion-Trap Quantum Computers | May, Daniel* et al. | 2024 |
| 2 | Pulsed infrared thermal imaging as inline quality assessment tool | Panahandeh, S.* et al. | 2023 |
| 3 | Infrared thermal imaging as inline quality assessment tool | Panahandeh, S.* et al. | 2021 |
| 4 | Pulsed Infrared Thermography Failure Analysis of Low-emissivity Specimens Without Contaminations Caused by High-emissivity Coatings | Wargulski, D. R.* et al. | 2020 |
| 5 | IR pulse thermography as failure analytical tool applied to die attach processes | May, Daniel* et al. | 2015 |
| 6 | LaTIMA an innovative test stand for thermal and electrical characterization of highly conductive metals, die attach, and substrate materials | Abo Ras, Mohamad* et al. | 2015 |
| Anzahl der Ergebnisseiten: | 1 |
| Anzahl der Dokumente: | 6 |
