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Nr.	Titel	Autor	Jahr
1	Failure Analysis for Electronic Packaging Materials: A Comparative Study of Pulsed Thermography and Lock-in Thermography	Wu, Yanan* et al.	2025
2	Closed-loop flow boiling cooler test stand for investigations on future power package designs	Schacht, Ralph et al.	2024
3	Enhancing Defect Detection Using Lock In Thermography	Mohamed, Doaa* et al.	2024
4	Accelerated Stress Testing and Failure Analysis of Thermal Greases	Wunderle, Bernhard et al.	2022
5	Finite Element Supported Data Augmentation for a Deep Learning Driven Intelligent Failure Analysis System Based on Infrared Thermography	Pareek, Kaushal Arun* et al.	2022
6	Thermal Heat Path Signature of a Standard D2PAK Power Package by Transient Thermal Characterization and Modelling	Sternberg, Maik* et al.	2022
7	Towards development of an intelligent failure analysis system based on infrared thermography	Pareek, Kaushal Arun* et al.	2022
8	Effect of Different Deconvolution Methods on Structure Function Calculation	Pareek, Kaushal Arun* et al.	2020
9	Inline failure analysis of electronic components by infrared thermography without high-emissivity spray coatings	Wargulski, Dan R. et al.	2020
10	Comparative Die-Attach Failure Analysis by Thermoreflectance, Infrared Thermography and Scanning Acoustic Microscopy	Wargulski, Dan R.* et al.	2018
11	Rapid Thermal Characterization of Materials with Ultra-High Resolution of Droplet Size Specimens using the Three-Omega Method	Grosse, Corinna et al.	2018
12	Double-sided cooling and thermo-electrical management of power transients for silicon chips on DCB-substrates for converter applications: Design, technology and test	Wunderle, Bernhard et al.	2013
13	Non-Destructive Tests for Via Structures in Organic Multi Layer PCBs	Schacht, Ralph et al.	2009
14	Progress in Thermal Characterisation Methods and Thermal Interface Technology within the "Nanopack" Project	Wunderle, Bernhard et al.	2009

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Anzahl der Dokumente:	14