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Nr.	Titel	Autor	Jahr
1	Low cycle fatigue of thin aluminium and copper layers and their susceptibility to corrosion	Breitenreiner, Sebastian et al.	2022
2	Low Cycle Fatigue of Thin Metal Films on Vibrating Silicon MEMS Cantilevers: Finite Element Modelling Facilitating Experimental Design	Pflugler, Nadine* et al.	2022
3	In-Situ Degradation Monitoring of Sputtered Thin Al Films on Si Cantilevers Inside SEM During Accelerated Stress Testing using Nano-Indenter Actuation and Vibration Loading	Jöhrmann, Nathanael* et al.	2021
4	Using AFM Measurements for Failure Indication During High-Cycle Fatigue Testing of thin Metal Films on MEMS Cantilevers	Osipova, Valentina et al.	2021
5	Button Shear Fatigue Test: Fracture-Mechanical Interface Characterisation under Periodic Subcritical Mechanical Loading	Shaygi, Mehrdad et al.	2019
6	Experimental determination of critical adhesion energies with the Advanced Button Shear Test	Pflügler, Nadine* et al.	2019
7	Plastic deformation and failure modes of moulding compounds during indentation loading and their importance for the quantitative characterisation of adhesion	Pflügler, Nadine* et al.	2019
8	Prediction of robustness of packages by cohesive zone finite element simulation and verification by non-destructive tests	Pufall, Reinhard* et al.	2019
9	Time-dependent behaviour of bonded silicon dies under subcritical, constant shear loading	Pflügler, Nadine* et al.	2019
10	Advanced risk analysis of interface delamination in semiconductor packages: A novel experimental approach to calibrating cohesive zone elements for finite element modelling	Pflügler, Nadine* et al.	2018
11	Low cycle fatigue of aluminium thin films on vibrating silicon MEMS cantilevers: Highly accelerated stress test and finite element modelling	Reuther, Georg M. et al.	2018
12	Temperature-dependent adhesion measurements of die attach materials to moulding compounds and lead frame surfaces enabling robust package designs	Pflügler, Nadine et al.	2018
13	A novel experimental approach to calibrating cohesive zone elements for advanced risk analysis of interface delamination in semiconductor packages	Reuther, Georg M. et al.	2017
14	High Cycle Fatigue Testing and Modelling of Sputtered Aluminium Thin Films on Vibrating Silicon MEMS Cantilevers	Onken, Tim et al.	2016
15	Non-destructive die attach test method for future robust packages – A proposal	Plfügler, Nadine et al.	2016
16	Reliability of Sputtered Thin Aluminium Films under Accelerated Stress Testing by Vibration loading and Modelling	Wunderle, Bernhard et al.	2016
17	Determination of residual stress with high spatial resolution at TSVs for 3D integration: Comparison between HR-XRD, Raman spectroscopy and fibDAC	Vogel, Dietmar et al.	2014
18	Residual stress investigations at TSVs in 3D micro structures by HR-XRD, Raman spectroscopy and fibDAC	Zschenderlein, Uwe et al.	2014
19	Determination of interface fracture parameters by shear testing using different theoretical approaches	Dudek, Rainer et al.	2012

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Anzahl der Dokumente:	19