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Nr.	Titel	Autor	Jahr
1	Low cycle fatigue of thin aluminium and copper layers and their susceptibility to corrosion	Breitenreiner, Sebastian et al.	2022
2	Low Cycle Fatigue of Thin Metal Films on Vibrating Silicon MEMS Cantilevers: Finite Element Modelling Facilitating Experimental Design	Pflugler, Nadine* et al.	2022
3	Button Shear Fatigue Test: Fracture-Mechanical Interface Characterisation under Periodic Subcritical Mechanical Loading	Shaygi, Mehrdad et al.	2019
4	Experimental determination of critical adhesion energies with the Advanced Button Shear Test	Pflügler, Nadine* et al.	2019
5	Plastic deformation and failure modes of moulding compounds during indentation loading and their importance for the quantitative characterisation of adhesion	Pflügler, Nadine* et al.	2019
6	Prediction of robustness of packages by cohesive zone finite element simulation and verification by non-destructive tests	Pufall, Reinhard* et al.	2019
7	Time-dependent behaviour of bonded silicon dies under subcritical, constant shear loading	Pflügler, Nadine* et al.	2019
8	Advanced risk analysis of interface delamination in semiconductor packages: A novel experimental approach to calibrating cohesive zone elements for finite element modelling	Pflügler, Nadine* et al.	2018
9	Temperature-dependent adhesion measurements of die attach materials to moulding compounds and lead frame surfaces enabling robust package designs	Pflügler, Nadine et al.	2018
10	A novel experimental approach to calibrating cohesive zone elements for advanced risk analysis of interface delamination in semiconductor packages	Reuther, Georg M. et al.	2017

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