Ergebnis der Datenbankabfrage
| Nr. | Titel | Autor | Jahr |
|---|---|---|---|
| 1 | Delamination and Combined Compound Cracking of EMC-Copper Interfaces. | Xiao, An et al. | 2010 |
| 2 | Interface fracture mechanics evaluation by correlation of experiment and simulation. | Keller, Jürgen et al. | 2010 |
| 3 | Interfacial Fracture Parameters of Silicon-to-Molding Compound | Schlottig, Gerd et al. | 2010 |
| 4 | Interfacial Strength of Silicon-to-Molding Compound Changes with Thermal Residual Stress. | Schlottig, Gerd et al. | 2010 |
| 5 | Establishing Fracture Properties of EMC-Copper Interfaces in the Visco-Elastic-Temperature Region | Xiao, An et al. | 2009 |
| 6 | Establishing Mixed Mode Fracture Properties of EMC-Copper (-oxide) Interfaces at Various Temperatures | Xiao, An et al. | 2009 |
| 7 | How to fabricate specimens for Silicon-to-Molding Compound interface adhesion measurements | Schlottig, Gerd et al. | 2009 |
| 8 | Induced Delamination of Silicon-Molding Compound Interfaces | Schlottig, Gerd et al. | 2009 |
| Anzahl der Ergebnisseiten: | 1 |
| Anzahl der Dokumente: | 8 |
