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Nr. Titel Autor Jahr
1 Transient thermal storage of excess heat using eutectic BiSn as phase change material for the thermal management of an electronic power module: design, technology, performance and reliability within a system approach Wunderle, Bernhard* et al. 2018
2 Packaging and Characterization of Silicon and SiC-based Power Inverter Module with Double Sided Cooling Manier, Charles-Alix et al. 2016
3 Transient Thermal Management by Using Double-sided Assembling, Thermo-electric Cooling and Phase-change Based Thermal Buffer Structures: Design, Technology and Application Springborn, Martin* et al. 2015
4 Double-sided cooling and transient thermo-electrical management of Silicon on DCB assemblies for power converter modules: Design, technology and test Wunderle, Bernhard et al. 2014
5 Phase Change based Thermal Buffering of Transient Loads for Power Converter Wunderle, Bernhard et al. 2014
6 Thermal management of electrical overload cases using thermo-electric modules and phase change buffer techniques: Simulation, technology and testing Springborn, Martin et al. 2014
7 Modelling and Characterisation of Smart Power Devices Wunderle, Bernhard et al. 2012
8 Advances in Thermal Interface Technology: Mono-Metal Interconnect Formation, Processing and Characterisation Wunderle, Bernhard et al. 2010
9 Influences of technological processing and surface finishes on thermal behaviour of thermal interface materials Abo Ras, Mohamad et al. 2010
10 Nanoporous interconnects Oppermann, Hermann et al. 2010
11 Progress in Thermal Characterisation Methods and Thermal Interface Technology within the "Nanopack" Project Wunderle, Bernhard et al. 2009
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