Ergebnis der Datenbankabfrage
| Nr. | Titel | Autor | Jahr |
|---|---|---|---|
| 1 | Characterization of EMC/LF interfacial fracture toughness using the advanced mixed-mode bending method | Schulz, Markus* et al. | 2018 |
| 2 | Determination of interface fracture parameters: Energy Release Rate and Mode Mixity using FEA | Maus, Ingrid et al. | 2013 |
| 3 | Establishing Mode Mix Dependency of Fracture Toughness in Microelectronic Components with Reduced Experimental Effort | Pape, Heinz et al. | 2012 |
| 4 | Interfacial fracture toughness measurements in microelectronic packages with different test setups on samples from production | Maus, Ingrid et al. | 2012 |
| Anzahl der Ergebnisseiten: | 1 |
| Anzahl der Dokumente: | 4 |
