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Nr. Titel Autor Jahr
1 Advanced Mixed-Mode Bending Test: Influence of the Surface Topography on the Fracture Behaviour of an EMC to Copper Lead Frame Bi-Material Interface Schulz, Markus* et al. 2019
2 Cost-efficient in-situ end-of-life prognostics of power dies and LEDs by junction temperature measurement Sheva, Sergey* et al. 2016
3 Transient Thermal Management by Using Double-sided Assembling, Thermo-electric Cooling and Phase-change Based Thermal Buffer Structures: Design, Technology and Application Springborn, Martin* et al. 2015
4 Double-sided cooling and transient thermo-electrical management of Silicon on DCB assemblies for power converter modules: Design, technology and test Wunderle, Bernhard et al. 2014
5 In situ monitoring of interface delamination by the 3ω-Method Schulz, Marcus et al. 2014
6 Phase Change based Thermal Buffering of Transient Loads for Power Converter Wunderle, Bernhard et al. 2014
7 Stress impact of moisture diffusion measured with the stress chip Schindler-Saefkow, Florian et al. 2014
8 Thermal management of electrical overload cases using thermo-electric modules and phase change buffer techniques: Simulation, technology and testing Springborn, Martin et al. 2014
9 Double-sided cooling and thermo-electrical management of power transients for silicon chips on DCB-substrates for converter applications: Design, technology and test Wunderle, Bernhard et al. 2013
10 Stress impact of moisture diffusion measured with the stress chip Schindler-Saefkow, Florian et al. 2013
11 Advances in Thermal Interface Technology: Mono-Metal Interconnect Formation, Processing and Characterisation Wunderle, Bernhard et al. 2010
12 3-D Thin Chip Integration Technology - from Technology Development to Application Fritzsch, Thomas et al. 2009
13 Progress in Thermal Characterisation Methods and Thermal Interface Technology within the "Nanopack" Project Wunderle, Bernhard et al. 2009
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