Ergebnis der Datenbankabfrage
| Nr. | Titel | Autor | Jahr |
|---|---|---|---|
| 1 | Fatigue behavior of aluminum and copper metallization for SiC during APC | Losbichler, Daniel* et al. | 2024 |
| 2 | Lifetime modeling of copper metallization for SiC power electronics | Losbichler, Daniel* et al. | 2023 |
| 3 | Interaction of advanced copper metallization with the assembly and interconnection technology | Losbichler, Daniel* et al. | 2022 |
| 4 | Reliability Assessment of Ag Sintered Joints Using a SiC Semiconductor and Determination of Failure Mechanism in the Field of Power Electronics | Schaal, Marco* et al. | 2020 |
| 5 | Micro Bending Test on Double Cantilever Beams: A specimen-centred approach to accurate determination of the visco-plastic properties of Sintered Silver for Power Electronics applications | Zschenderlein, Uwe* et al. | 2019 |
| 6 | Silver Sintering in Power Electronics: The State of the Art in Material Characterization and Reliability Testing | Schaal, Marco et al. | 2018 |
| Anzahl der Ergebnisseiten: | 1 |
| Anzahl der Dokumente: | 6 |
