Springe zum Hauptinhalt
Universitätsbibliothek
Universitätsbibliographie
Universitätsbibliothek 

Ergebnis der Datenbankabfrage

Nr. Titel Autor Jahr
1 Characterization of EMC/LF interfacial fracture toughness using the advanced mixed-mode bending method Schulz, Markus* et al. 2018
2 Delamination Detection in an Electronic Package by Means of a Newly Developed Delamination Chip Based on Thermal Pixel (Thixel) Array Kumar, Akhil et al. 2018
3 Spatially Resolved, Non-Destructive in-situ Detection of Interface Degradation by Remote Electrical Readout of an on-chip Thermal Pixel (Thixel) Matrix Wunderle, Bernhard et al. 2018
4 Status and review of advanced mixed-mode bending fracture test (AMB) Schulz, Marcus et al. 2018
5 Non-destructive in-situ monitoring of delamination of buried interfaces by a thermal pixel (Thixel) chip Wunderle, Bernhard* et al. 2017
6 Cost-efficient in-situ end-of-life prognostics of power dies and LEDs by junction temperature measurement Sheva, Sergey* et al. 2016
7 Master curve synthesis by effective viscoelastic plastic material modeling Schindler-Saefkow, Florian et al. 2016
8 Advanced mixed-mode bending test Experimental-numerical characterization of the critical energy release rate Gc including Mixed-Mode-Angle psi in interfaces under independent external loads Schulz, Marcus et al. 2013
9 Stress impact of moisture diffusion measured with the stress chip Schindler-Saefkow, Florian et al. 2013
10 Stress impact of thermal-mechanical loads measured with the stress chip Schindler-Saefkow, Florian et al. 2013
11 Advanced mixed-mode bending test: A rapid, inexpensive and accurate method for fracture-mechanical interface characterisation Wunderle, Bernhard et al. 2012
12 Advanced Mixed-Mode Bending Test: A Rapid, Inexpensive and Accurate Method for Fracture-Mechanical Interface Characterisation Wunderle, Bernhard et al. 2012
13 Experimental and numerical methods for evaluation of interface cracks in electronics systems Keller, Jürgen et al. 2012
14 Interfacial fracture toughness measurements in microelectronic packages with different test setups on samples from production Maus, Ingrid et al. 2012
15 Fracture-Mechanical Interface Characterisation for Thermo-Mechanical Co-Design – An Efficient and Comprehensive Method for Critical Mixed-Mode Data Extraction Wunderle, Bernhard et al. 2011
16 Interface fracture mechanics evaluation by correlation of experiment and simulation. Keller, Jürgen et al. 2010
Aktuelle Seite:
Anzahl der Ergebnisseiten: 1
Anzahl der Dokumente: 16

Soziale Medien

Verbinde dich mit uns: