Ergebnis der Datenbankabfrage
| Nr. | Titel | Autor | Jahr |
|---|---|---|---|
| 1 | Failure Analysis for Electronic Packaging Materials: A Comparative Study of Pulsed Thermography and Lock-in Thermography | Wu, Yanan* et al. | 2025 |
| 2 | Physics-Based Reliability Analysis of Power Modules at Substrate and Component Level | Mathew, Anu et al. | 2025 |
| 3 | Three-Omega Method for Characterization of Thermal Conductivity of Samples at Cryogenic Temperatures | Rincon, Carlos et al. | 2025 |
| 4 | Thermal Characterisation and Technology of Intercalated Graphene-Based Nano-Laminates | Wunderle, Bernhard et al. | 2024 |
| 5 | Thermal Conductivity Measurements of Thermal Interface Materials Using the Bidirectional 3-Omega Method | Grosse-Kockert, Corinna et al. | 2022 |
| Anzahl der Ergebnisseiten: | 1 |
| Anzahl der Dokumente: | 5 |
