Ergebnis der Datenbankabfrage
| Nr. | Titel | Autor | Jahr |
|---|---|---|---|
| 1 | Gallium-based Solid Liquid Interdiffusion Bonding of Semiconductor Substrates near room temperature | Froemel, Joerg | 2015 |
| 2 | A novel approach for increasing the strength of an Au/Si eutectic bonded interface on an oxidized silicon surface | Haubold, Marco et al. | 2012 |
| 3 | HF-MEMS Schalter mit ohmschen Kontakt und lateraler Bewegungsrichtung | Leidich, Stefan et al. | 2011 |
| 4 | Investigations of thermocompression bonding with thin metal layers | Froemel, Joerg et al. | 2011 |
| 5 | Metal Thermo Compression Bonding at Wafer Level and its capabilities for 3D integration | Baum, Mario et al. | 2011 |
| 6 | A fast and low actuation voltage MEMS switch for mm-wave and its integration | Akiba, A. et al. | 2010 |
| Anzahl der Ergebnisseiten: | 1 |
| Anzahl der Dokumente: | 6 |
