Ergebnis der Datenbankabfrage
| Nr. | Titel | Autor | Jahr |
|---|---|---|---|
| 1 | Establishing Mode Mix Dependency of Fracture Toughness in Microelectronic Components with Reduced Experimental Effort | Pape, Heinz et al. | 2012 |
| 2 | Fracture Toughness Characterization and Modeling of Interfaces in Microelectronic Packages - A Status Review | Pape, Heinz et al. | 2012 |
| 3 | Interfacial fracture toughness measurements in microelectronic packages with different test setups on samples from production | Maus, Ingrid et al. | 2012 |
| 4 | Delamination and Combined Compound Cracking of EMC-Copper Interfaces. | Xiao, An et al. | 2010 |
| 5 | Interfacial Fracture Parameters of Silicon-to-Molding Compound | Schlottig, Gerd et al. | 2010 |
| 6 | Interfacial Strength of Silicon-to-Molding Compound Changes with Thermal Residual Stress. | Schlottig, Gerd et al. | 2010 |
| 7 | How to fabricate specimens for Silicon-to-Molding Compound interface adhesion measurements | Schlottig, Gerd et al. | 2009 |
| Anzahl der Ergebnisseiten: | 1 |
| Anzahl der Dokumente: | 7 |
