Ergebnis der Datenbankabfrage
| Nr. | Titel | Autor | Jahr |
|---|---|---|---|
| 1 | Transient Thermal Management by Using Double-sided Assembling, Thermo-electric Cooling and Phase-change Based Thermal Buffer Structures: Design, Technology and Application | Springborn, Martin* et al. | 2015 |
| 2 | Double-sided cooling and transient thermo-electrical management of Silicon on DCB assemblies for power converter modules: Design, technology and test | Wunderle, Bernhard et al. | 2014 |
| 3 | Double-sided cooling and thermo-electrical management of power transients for silicon chips on DCB-substrates for converter applications: Design, technology and test | Wunderle, Bernhard et al. | 2013 |
| 4 | Transient cooling of power electronic devices using thermoelectric coolers coupled with phase change materials | Caroff, Tristan et al. | 2013 |
| Anzahl der Ergebnisseiten: | 1 |
| Anzahl der Dokumente: | 4 |
