Ergebnis der Datenbankabfrage
| Nr. | Titel | Autor | Jahr |
|---|---|---|---|
| 1 | Thermal Test Vehicle for HPC - System Level Approach for Investigation of the Thermal Heat Path Signature with the Property of Spatial Resolution | Sternberg, Maik* et al. | 2023 |
| 2 | Thermo-Mechanical Reliability during Technology Development of Power Chip-on-Board Assemblies with Encapsulation | Wunderle, Bernhard et al. | 2009 |
| Anzahl der Ergebnisseiten: | 1 |
| Anzahl der Dokumente: | 2 |