Ergebnis der Datenbankabfrage
| Nr. | Titel | Autor | Jahr |
|---|---|---|---|
| 1 | Thermal Test Vehicle for HPC - System Level Approach for Investigation of the Thermal Heat Path Signature with the Property of Spatial Resolution | Sternberg, Maik* et al. | 2023 |
| 2 | Latest advancements towards delamination detection in a FCOB assembly using Thermal Pixel (Thixel) array | Kumar, Akhil* et al. | 2019 |
| 3 | Delamination Detection in an Electronic Package by Means of a Newly Developed Delamination Chip Based on Thermal Pixel (Thixel) Array | Kumar, Akhil et al. | 2018 |
| 4 | Spatially Resolved, Non-Destructive in-situ Detection of Interface Degradation by Remote Electrical Readout of an on-chip Thermal Pixel (Thixel) Matrix | Wunderle, Bernhard et al. | 2018 |
| Anzahl der Ergebnisseiten: | 1 |
| Anzahl der Dokumente: | 4 |
