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Nr. Titel Autor Jahr
1 Crack Growth Modelling in Semiconductor Package Materials by Digital Image Correlation and Finite Element Methods George, Brinda et al. 2025
2 Design of Single-Port Surface Acoustic Wave(SAW) Resonator on GaN Wafer as Stress Tester System for Micro and Nano Structures Mohammadi, Arash* et al. 2025
3 Enhancing nanostructure and energy harvesting efficiency in sustainable BCZT piezoelectric materials through calcination temperature optimization Missaoui, Sarra* et al. 2025
4 Examination and Simulation of a High-Cycle Fatigue Tester for Accelerated Stress Testing with Simplified Cantilever Specimens for Fracture-Mechanical Interface Characterization Walther, David* et al. 2025
5 Failure Analysis for Electronic Packaging Materials: A Comparative Study of Pulsed Thermography and Lock-in Thermography Wu, Yanan* et al. 2025
6 Fatigue Delamination Study of Parylene as Electronic Packaging Material Rincon, Carlos et al. 2025
7 Numerical Optimization of the Interfacial Crack Tip Position in Delaminated Bi-Material Beams Evaluated with the AMB Fracture Test Schulz, Marcus et al. 2025
8 Physics-Informed Synthetic Data Generation for Deep Learning-Based Defect Detection in Infrared Thermography Pareek, Kaushal Arun 2025
9 Reduced-order model for solder balls – Potential of projection-based approaches for representing viscoplastic behavior Feuchter, Mike* et al. 2025
10 Tailoring Nanostructure and Energy Harvesting Performance in Sustainable Bczt Piezoelectric Materials Through Calcination Temperature Control Missaoui, Sarra et al. 2025
11 Tailoring the properties of lead-free BZT-based polymer composites for the realization of efficient and robust nanogenerator Jeder, Khawla* et al. 2025
12 Thermal Characterization of Heat Pipe Embedded Heat Spreaders for High Performance Computer Cooling in Automotives Erol, Baris* et al. 2025
13 Thermal Effects in Surface Acoustic Wave Devices Induced by Damping Boldeiu, George* et al. 2025
14 Thermal-Resistance-Based Reliability of TIM1 Materials in a Lidded Thermal Test Vehicle Under Active Thermal Load-Cycling Sternberg, Maik et al. 2025
15 Three-Omega Method for Characterization of Thermal Conductivity of Samples at Cryogenic Temperatures Rincon, Carlos et al. 2025
16 Truly integrated carbon nanotubes (CNT) in oxide ceramics for micro-strain sensing applications Rajendran, Dhivakar* et al. 2025
17 Verification of Material Models of an Epoxy Mold Compound Used in Power Module Panchwagh, Akshay Vivek et al. 2025
18 Closed-loop flow boiling cooler test stand for investigations on future power package designs Schacht, Ralph et al. 2024
19 CoolStar: A New Approach to Automotive HPC Cooling with Improved Thermo-Mechanical Design Erol, Baris* et al. 2024
20 Design and Simulation of a High Cycle Fatigue Vibration Tester for Accelerated StressTesting of Thin Films and Bimaterial interfaces Walther, David* et al. 2024
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Anzahl der Dokumente: 323

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