Eintrag in der Universitätsbibliographie der TU Chemnitz
Mikutta, Lukas
Lutz, Josef (Prof. Dr) ; Midtgard, Ole-Morten (Prof. Dr.) (Gutachter)
Thermal behavior and aging mechanisms of power device packages
Kurzfassung in englisch
With the conversion of the energy supply system towards renewable energysources and the focus of the automotive industry on electric vehicles, knowledge
of the reliability of power electronic components is crucial. Therefore in
this thesis the thermal mechanical behavior of power electronic packages and
related fatigue mechanisms are investigated. First different opportunities for
increasing the short circuit ruggedness by measures of the packaging technology
are evaluated. For that the metallization material and thickness are
varied as well as the die attach technology. Subsequent the methodology of
thermal mechanical simulations of packages under power cycling conditions
is discussed and the stress- strain development on different points in the die
attach layer is explained. Furthermore different factors impacting the result
quality are pointed out.
The main focus of this thesis is on the thermal mechanical processes in power
electronic packages. Hence di erent parameters like chip geometry, semiconductor
material, die attach, package type and power cycling parameters are
investigated to assess the respective impact on the mechanical load in the
die attach layer.
In the end the failure location in insulated power modules depending on the
power cycling conditions is evaluated with the help of simulations. Thereby
the effect of different boundary conditions on the result accuracy is discussed.
| Universität: | Technische Universität Chemnitz | |
| Institut: | Professur Leistungselektronik | |
| Fakultät: | Fakultät für Elektrotechnik und Informationstechnik | |
| Dokumentart: | Dissertation | |
| Betreuer: | Lutz, Josef (Prof. Dr.) | |
| ISBN/ISSN: | ISBN 978-3-8439-3862-4 | |
| Quelle: | Chemnitz : Verlag Dr. Hut, München, 2018. - 204 S. | |
| Freie Schlagwörter (Deutsch): | Simulation , Alterungsmechanismen , Kurzschluss | |
| Freie Schlagwörter (Englisch): | Simulation , Ageing mechanisms , Short circuit | |
| Tag der mündlichen Prüfung | 23.05.2018 |
